G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer Revision:SEMI G88-0211 (Reapproved 0217) - Inactive *This Safety Guideline has the

*This Safety Guideline has the option to purchase the Current document with a redline document (Current + Redline)

electrical

may interfere with plating or solder dip finishing operations

Sori can significantly affect the yield of semiconductor device processing

(LCD) 用BLUに適用され，その測定は光学的領域のみを対象とする。その他の領域（電気的性質，信頼性など）については，他のSEMIスタンダードにより規定される。

G08800 - SEMI G88 - Specification for Tape Frame for 450 mm Wafer Revision:SEMI G88-0211 (Reapproved 0217) - Inactive *This Safety Guideline has theThe purpose of this Document is to standardize the specifications for 450 mm wafer tape frames used between the dicing process and the die bonding process, and also used for shipping and handling. This Standard is applicable to 450 mm wafer tape frames. This Standard documents the dimensions, characteristics, and measurement methods for 450 mm wafer tape frames. This Standard can be used as the specification sheet for tape frame upon purchasing.