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SEMI C30-0301 (technical revision)
holes) in thin silicon slices
Values of the image obtained using this method are reported in Ra
The scope of this Document is a grade of xylene used in the semiconductor industry
2 This Specification and Guide also provides assay and impurity limits for higher purity Tiers of sulfuric acid for which a need has been identified
3D00100 - SEMI 3D1 - Terminology for Through Silicon via Geometrical Metrology StdPbc-0924 SEMI C30-0301 (technical revision)Clear and commonly accepted definitions are needed for efficient communication and to prevent misunderstanding between buyers and vendors of metrology equipment and manufacturing services. The purpose of this Document is to provide a consistent terminology for the understanding and discussion of metrology issues important to through silicon vias (TSV). The scope of this Document is limited to the definitions of terms used to specify measured