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silver layer adhesion and solder ability after firing
1 In-Scope
but they may also be applied to wafers of other materials
本安全ガイドラインには以下の項が含まれる。
a scanning solution for collecting metal contamination from wafer surfaces is recommended for using the solution compositions optimized by ensuring recovery rate with 75%–125% (see ¶¶ 5
F00700 - SEMI F7 - フロロカーボン製チューブフィッティング接合部の引張り強さを測定するテスト方法 StdTpc-Package Specifications silver layer adhesion and solderFacilities CommitteeNorth American Facilities Committee199810North American Regional Standards Committee19992SEMI On Line199921992 NOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. SIU. S. Referenced SEMI Standards None.