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Flex Electronics Webinar Master Class Series: Batteries, AI, HI, Materials, Applications, Sustainability (On Demand 2021) StdPbc-1011 Many metallic impurities form recombination

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Description

Many metallic impurities form recombination centers in germanium and silicon

and cost-effectiveness as key elements of successfully installing semiconductor processing equipment into wafer fabrication facilities

originally published by ASTM International as ASTM F534-77T

previously published July 2013

자동 프로세싱 관리의 실행으로 재료에 대한 오처리(misprocessing)를 없에고

Flex Electronics Webinar Master Class Series: Batteries, AI, HI, Materials, Applications, Sustainability (On Demand 2021) StdPbc-1011 Many metallic impurities form recombination

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