Semiconductor devices. Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components best-seller The aim of the BS

The aim of the BS EN 13879 is to provide best industry practices to demonstrate the bending properties of the wood-based panels

covering measuring capacities from 0 to 300 mm

Introduction of revised naming conventions which better match with those found in ITU-T recommendations G

The field of nanotechnologies is advancing rapidly and is expected to impact on virtually every facet of global industry and society

It might also be of interest to other organizations

Semiconductor devices. Mechanical and climatic test methods - Acoustic microscopy for plastic encapsulated electronic components best-seller The aim of the BS