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M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles Revision:SEMI M73-0125 - Current 本方法は,

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Description

本方法は,

Detail configuration requirements for each are shown in Table 2

• As a base model to be used and extended by other SEMI Equipment Communication Standards

SEMI MF154-0305 (technical revision)

SEMI E99-0623 (technical revision)

M07300 - SEMI M73 - Test Method for Extracting Relevant Characteristics from Measured Wafer Edge Profiles Revision:SEMI M73-0125 - Current 本方法は,1 Purpose 1. 1 SEMI M1 specifies the contour of the shaped edge of silicon wafers by using templates that allow a wide variation in wafer edge profiles manufactured by silicon suppliers to still meet the specification. 1. 2 In many advanced wafer applications, a much tighter specification of the edge profile is required to control variations in subsequent circuit processing. These specifications frequently include values for certain characteristics

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