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G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling StdPbc-1119 SEMI E157-0710 (first published)

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Description

SEMI E157-0710 (first published)

Detailed information on the method is found in ASTM G150

and define the parameters for color properties of electronic paper display

and the statistical calculations of the results should remain consistent with the procedures of this Practice

SEMI G5-85 (technical revision)

G04800 - SEMI G48 - Specification for Measurement Method for Molded Plastic Package Tooling StdPbc-1119 SEMI E157-0710 (first published)This document is prepared to enable standard measurement techniques to be used. It is intended that the measurement techniques described in the specification will apply to all molded plastic package tooling (i. e., DIPS, SIPS, PCC, SO, Quad, and TAB). Referenced SEMI Standards SEMI G14 Plastic Molded DIP Tooling SEMI G16 Plastic Chip Carrier Tooling SEMI G36 Plastic Molded High Density TAB Quad Tooling SEMI G37 Plastic Molded SO Package Tooling

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